Hello TechNetters!
I am interested in the baking parameters being used for assembled PCBs
prior to BGA rework in order to reduce risk of moisture-related damage.
Component vendors often suggest 125'C for 24 hours, but this is based on
component level requirements for drying out unmounted components. I
have heard of baking assembled PCBs at 90'C for 48 hours.
Your input is most appreciated.
Charles.
--
Charles Elliott, P.Eng.
Physical Technology Engineer, Alcatel CID
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