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October 2000

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TechNet <[log in to unmask]>
Subject:
BGAs voids in solder
From:
Guy Ramsey <[log in to unmask]>
Date:
Fri, 6 Oct 2000 10:48:30 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
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Where can I find information, including documented studies, on the
beneficial effects of voids in BGA's. Has anyone produced information that
would contrast the IPC specification of less than 25% voiding in the ball to
board interface?

 Guy Ramsey
American Competitiveness Institute
Senior Lab Technician / Instructor
610 362-1200 ext 107

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