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October 2000

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TechNet <[log in to unmask]>
Subject:
die in leadframe
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"[log in to unmask]" <[log in to unmask]>
Date:
Mon, 30 Oct 2000 15:17:36 -0800
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"TechNet E-Mail Forum." <[log in to unmask]>, "[log in to unmask]" <[log in to unmask]>
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I am looking for guidance on die design for assembly in leadframe products.
 Specifically:  a die assembled in a soic leadframe.  I am having
difficulty in finding reference to this subject and I'm wondering if I am
using the right terms to describe this.  Can anyone help with 1) defining
this process, 2) refer design guidelines for this process?
Thank you.

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