LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

October 2000

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET October 2000

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Condense Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Sender:	TechNet <[log in to unmask]>
X-To:	[log in to unmask]
Date:	Fri, 27 Oct 2000 10:04:18 EDT
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:	Re: Analysis of part lead solderability
MIME-Version:	1.0
Content-Transfer-Encoding:	7bit
Content-Type:	text/plain; charset="US-ASCII"
From:	[log in to unmask]
Parts/Attachments:	text/plain (21 lines)

Hi Michael
Before I would recommend looking for contamination, I would do some
solderability
testing of the components.  Component lead solderability testing is pretty
straight forward and can imploy accelerated aging through steam prior to
testing.  Then if
there was a problem, and depending on what the de-wet or non-wet areas looked
like would I continue with contamination testing.

Susan Mansilla
Robisan Lab

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG