I have seen this exact condition a couple of times, but I don't have any
photos to share with you.  In both cases it was a board with a fairly large
variance in thermal density from one area to another.  The TC's for the
profiler were attached to places that tended to run hot, while the "bad"
solder connections were in areas that ran much cooler.  Those in fact did not
see liquidus nearly long enough, nor did they reach a sufficient peak temp.

Jon Moore

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