I am asking anyone for comments and help!!!  I have a customer who is using a
vibration test of 10 minutes to determine any "workmanship" errors on SMT
assemblies for RF applications.  He seems to be having problems with caps
(1206, 0805, 1210) on assemblies because these chips are randomly failing
either in the field or at pre-test.  We have run some thermal tests on
various reels of components (samples of ten pcs. per reel) without finding
any defects.  We have run some tests on assemblies after all SMT operations
without finding any defects.  My question is can the vibration testing be
affecting the reliability of the caps?  Is vibration testing a common
practice?  What testing criteria should be used for vibration testing---if at
all?

Thank all for the help!!  Please send responses to Bill Black at
[log in to unmask]

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