Dear Technetters!
We test SMT components for solderability after more than 6 months of
storage.
On most of them we perform the dip test and also the solder paste
reflow  test.(of course not on the same ones).
Sometimes we do not get the same results:
The dip test shows more defects than the reflow test. I know that the
test conditions, especially the flux, are not the same, and the final
judgement is done according to the reflow test, although theoretically,
the dip test seems to me more accurate .

What is the right decision in your opinion?

Regards,
Gaby

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