Thechneters,

I'd like to know if there are special design rules for the solder mask on
PCB.
Most of PCBs I have seen have pads surrended with a gap and solder mask.
In our case I have got a PCB with solder mask on the periphery of BGA pads
(to prevent bridging according to the customer).
It seems to me that the solder mask on the periphery of pads is not so
efficient as expected to prevent bridging and it seems to be also
responsible of the poor mechanical properties of the joint.
Does anybody have experience with this weird technique (solder mask on the
periphery of pads)?

Thanks in advance,


Walter Horaud

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