Rick

We have eliminated the dams on 25 mil and below.  Fewer headaches.  We are not having any
bridging problems.  I feel that the stencil gaskets to the pad better without the solder
dams.

One thought from the bleachers,

Gary Camac

Rick Thompson wrote:

> Hi,
>
> We have a customer who has a board with 20 mil pitch QFP's on it.  The
> actual pad size is 11.8 mils wide and there is a 2 mil gap in the soldermask
> around the pads leaving 4.2 mils of solder mask between the pads.  The board
> house that is building these says they can't maintain the soldermask between
> the pads and is asking for a window around all leads in the group or a
> tightening of the soldermask openings around the pads.  Before I go to our
> customer with this, I'd like to get some feedback on whether or not this is
> unreasonable?  Are these dimensions acheivable or should I ask our customer
> for a deviation?
>
> Thanks in advance,
>
> Rick Thompson
> Ventura Electronics Assembly
> 2665A Park Center Dr.
> Simi Valley, CA 93065
>
> +1 (805) 584-9858 voice
> +1 (805) 584-1529 fax
> [log in to unmask]
>
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