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September 2000

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Subject:
From:
"David J. Sanchez" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 Sep 2000 14:03:16 -0700
Content-Type:
text/plain
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text/plain (109 lines)
Rudy,

NO, YOU ARE DEAD WRONG!

ORP/Normality systems do not have that type of control.  Not only that they
require constant maintenance and they waste acid just so the system can get
a reading.  Sure our system works only one way but it also happens to be the
BEST way for the customer.  The Vis-U-Etch 5 does not waste chemistry and
achieves the best possible etch quality.  Not only that all you have to do
is hang it on the wall and forget about it.  Maybe you think that customers
enjoy hiring a chemical engineer to run an ORP/Normality system.  We think
that they have better things to do with their time and money!

Take a look at Cross-Section Comparisons on our web site www.oxfordvue.com

Note that the example using the Vis-U-Etch 5 was done with an older etcher
without manifold oscillation or fan nozzles.  Of course it works even better
with a properly configured etcher.

We have a customer etching copper several times thicker then 3 oz and if the
Vis-U-Etch 5 performed like an ORP/Normality they would probably undercut
the traces so badly that they would fall off.

Unless you have invented some new probes you will never be able to get an
ORP/Normality system to work as efficiently as the Vis-U-Etch 5.  Dream on
Rudy, dream on!

David 
  
-- 
David J. Sanchez
Oxford V. U. E., Inc.
Post Office Box 661896
Arcadia, California 91066-1896
U. S. A.

Shipping address:
11711 Clark Street, Suite 108
Arcadia, California 91006-5874
U. S. A.

Telephone: (626) 256-6557
FAX: (626) 256-6567
www.oxfordvue.com

> From: "<Rudy Sedlak>" <[log in to unmask]>
> Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
> Date: Fri, 29 Sep 2000 16:09:35 EDT
> To: [log in to unmask]
> Subject: Re: [TN] Etch factor and 3 OZ copper foil
> 
> In a message dated 9/29/00 8:07:15 AM Pacific Daylight Time,
> [log in to unmask] writes:
> 
> << In terms of cupric chloride
> bath chemistry, a comparison of the operating parameters between ORP and
> turbidimetric
> methods of control is as follows:
> 
> Method of Control                ORP                Turbidimetric
> 
> Cu (total), g/L             150-180                  210-235
> HCl, N                        1 - 3
> 0.02-0.04
> Baume'                      29 - 31
> 38-40
>>> 
> 
> WRONG WRONG AND WRONG!
> You can control the etchant to ANY READING in a ORP/acid/Baume' type
> controller.  That is the beauty of that sort of system, versus the
> turbidimetric system, the turbidimetric system defines what your readings
> MUST be, whereas the other system allows you to choose what YOU want.
> 
> It is the replenisher  chemistry that really affects what Baume' you can run,
> with Chlorate limiting you to lower levels of Copper, than Hydrogen Peroxide.
> 
> Rudy Sedlak
> RD Chemical Company
> 
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