TECHNET Archives

September 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Shirley Xiao <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 Sep 2000 01:28:00 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines)
Dear Technetters:
  Does anyone has experience to get 7 mil/7mil line
width/gap out of 3 OZ copper foil by inner layer
etching (CuCl2, HCL, H2O2)? Is there any concerns
about undercut or peel strength?
 How about the etch factor for CuCl2 etching? Can we
get 3?

Thanks and best regards
Shirley



__________________________________________________
Do You Yahoo!?
Yahoo! Photos - 35mm Quality Prints, Now Get 15 Free!
http://photos.yahoo.com/

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2