Appreciate is someone can provide some expert advice on this.

I have an assembly that requires the SMD attachments to be done first before the
die attachment. The die attached adhesive requires to be cured at 175 degrees C
for maximum efficiency for one hour. My susbstrate is FR4.

My question is: are there any known problems on solder joint and PCB reliability
issues if the assembly is additionally cured for one hour at 175 degrees C for
the die attachment process? Are there any papers that have been published on
this?

Looking forward to your expert advice.

Thanks & Best Regards
Ng Kuan Kuan
DSO National Labs
Singapore

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