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September 2000

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Subject:
From:
Park Matthew <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 Sep 2000 12:03:29 -0500
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Mike, try clinch DIP IC pins in 45 degree angle from the bottom of board
surface.  It probably requires some mechanical adjustments on the part of
DIP inserters.  It fixed all shorting problem in my previous life.

Matthew S. Park
Sr. Process Engineer
Phoenix International Corporation
A John Deere Company

% Phone: (701)282-9364, Ext 434
*      Fax: (701)-282-9365
*   E-mail: [log in to unmask]



-----Original Message-----
From: Mike Sewell [ mailto:[log in to unmask] <mailto:[log in to unmask]> ]
Sent: Thursday, September 28, 2000 11:40 AM
To: [log in to unmask]
Subject: Re: [TN] Lead Clinching over soldermask


We're going through the same scenario right now and for the next ~18,000
assys.  Same TH board that Steve G. has taken such a liking to.  Massive
amounts of cut/clip/rotate leads are required on this one.  The problem is
primarily with the DIP ICs on this board as they are laid out very close and
have tracks running between the rows of leads on the bottom.  If the design
isn't "locked in stone"  I'd suggest re-routing traces or perhaps adding
another layer to cover the problem traces/conductors.  If that isn't an
option, you might stuff those parts loose formed and pretrimmed - provided
its only a few per bd giving you trouble.  Reducing the lead protrusion
should make the lead less likely to bend in the field as more of the lead
will be supported by the solder joint...

Regards,
Mike Sewell

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