I want to thank those who responded to my request for suggestions regarding
the assembly of my dense board.  If you recall, it is 6002 Duroid, .005"
thick, 1.5" x 2", with 270 0402s on it.  The direction I'm leading to is to
panelize the boards (6" x 9").  The panel will be placed on a solid plate
(.050"?) and held in place with another plate (window frame) on top.  This
would allow me to go through pick & place and reflow by handling the fixture
only.  How does this approach sound?  Would you suggest the fixture be made
of stainless steel or should I consider a more thermally stable material
like graphite?

Second question...  This assembly is being used for a high frequency RF
application, so solder coating the boards will effect performance.  (Just
try and HASL this board!)  The RF guys like bare copper, gold, silver, maybe
even nickel or tin plating.  Does anyone have any recommendations regarding
surface finish for this assembly?  (from a board fabrication and assembly
process perspective... I'll deal with the RF guys).

Thanks again,
Jim M.

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