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September 2000

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Subject:
From:
Kuczynski Michael <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 1 Sep 2000 07:20:54 -0400
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I always try to keep .007 (min.) between pads for solddermask on fine pitch devices.

Ran into too many other problems (from bd. house to assy.) to make it any less.


Michael Kuczynski       Librarian/Sr. Designer
L3 Communications       201-393-2122 (Phone)
Space & Navigation      201-393-6681 (Fax)
699 Rt46E PL1/H13       Mail Stop PL1/J8
Teterboro NJ 07608
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