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September 2000

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 27 Sep 2000 08:53:26 +0200
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 We work a lot with Arlon, Roger and like. My first reaction: why not an ASIC and a handful components instead? Mounted on a BGA platform? When you insist 5 thou thick, I wonder if you talk about mil skin electronic tech? No, too oldfashioned with so many discretes..hm..we have been highspeed pick-and-placing on Rogers boards for years, and are going to use even 0202 but I must confess that we would never think one second of using a 6002 without brass backing. My first reaction is therefore (without being ignorant): are you really serious? As we live in 2000 now, I think your EDE will simplify the equation if you just give him time to think....
Good Luck anyway
Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: den 26 september 2000 19:11
To: [log in to unmask]
Subject: [TN] DENSE SMT ASSEMBLY


Hello Technet:

Well, the Electrical Engineers did it to me again!  They're designing an
assembly consisting of a Teflon surface mount board .005" thick,
approximately 1.5 x 1.7", with 320 components!  The component mix is mostly
0402's (resistors, caps and inductors) and 30 SOT-363s.  Does anyone have
any suggestions as how to automate this assembly process?

Thanks in advance,
Jim Marsico

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