Please remove my name from the mailing list.  The system you have in place
for doing this is apparently not working properly.

Thanks,

Wendy Reeves,
PEI Electronics, Inc.
ISO 9000/(CP)2 Coordinator
Quality Engineer
Direct Line: (256) 895-2251




*-----Original Message-----
*From: Poh Kong Hui [mailto:[log in to unmask]]
*Sent: Tuesday, September 26, 2000 7:38 AM
*To: [log in to unmask]
*Subject: Re: [TN] Pad/Component Layout
*
*
*Hi,
*
*I believe you have attached a Bitmap file for us to view & comment.
*But I do not think it is really being attached onto your Email.
*Regards,
*Poh
*
*
*
*
*At 03:17 PM 9/25/00 -0400, you wrote:
*>My company is a manufacturer of oscillators and I have some questions
*>regarding appropriate pad/lead layout.  I am not a design
*engineer and seek
*>advice.  Attached is a copy of the proposed layout.  Given the small
*>dimensions and the spacing between solder areas, there is concern of
*>problems with manufacturability.  I have two questions:  1.)
*Does anyone see
*>any issues with this current layout and 2.) If the 0.600
*dimension (penciled
*>in by hand) is shortened to any degree, would this be a
*problem?  Please
*>advise, thank you.
*>
*> <<PadLayout.bmp>>
*>Regards,
*>Mark Gilbert, Product/Process Engineer
*>FOX Electronics
*>For Frequency Control Solutions. . . Fast:
*>1-888-GET2FOX, ext. 289
*>Fax: 941-693-1554
*>
*>http://www.foxonline.com/ <http://www.foxonline.com/>
*>
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