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September 2000

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 25 Sep 2000 14:57:33 +0300
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text/plain (113 lines)
Strange, Ingemar, as a well established entrepreneur family of rievers from the other side of Kielder and up into Pictland, I thought we had sacked Otterburn and all its inhabitants in 1356. We extended our sheep-stealing down to Jarrer Slakes which is where we learnt that most peculiar of all languages, Geordie, 'Ah divven knaa, hinny, whe's buggered th'bandit" (translation for the uninitiated: I don't know, my dear lady, who has rendered the fruit machine inoperable). However as a Scotsman living in Cyprus, where my rieving is confined to buying fillet of lamb at the local butchers
at a ridiculously low price, you will understand my Borders ancestry is really past history. Notwithstanding, I agree that the Northumbrian moors are one of the finest, more or less unspoilt, areas in England. Talking of the region, my wife still has a beautiful cashmere stole she bought from Otterburn Mill shortly after we were married 41 years ago.

Strictly OT, but, what the hell!

Brian

"Ingemar Hernefjord (EMW)" wrote:

> Hi Roger,
> don't tell me you work in Newcastle, was there last week, could have brought some job with me for you, OK, may be other occasion. What I wanted was having Via's opinion about bleeding from solder mask when selective Ni/ immersion Gold is applied. Also about Lead Carbonate and Adipin Acid and such stuff in vias bleeding up on solderpads during solder oven process. Been looking at samples from you before. May speak offline with you later, today other UK Co will solve the problem (I hope).
>
> As for Humbria my wife and I lived in Otterburn Tower from AD1330, I love the moors up there, also like Balvini and Ad Cnoc.
>
> Back to issue, good to hear plasma tricks or/and vacuum bake can make bad boards useful again. But according to specialists on my company you (Via) and others do other things when you get 'dirt' on pads, namely some kind of activation by means of Purasolve or special mild acidous mixtures. We tried such an activation bath in order to get better solderability on ENIG SMD PWBs, but found no improvement. Our solder test is this: screenprint solder spheres approx. 1/3 of pad dia and let pass oven at normal. Wetting diameter and yield is measure on what good surface we have to do with.
>
> What do you thing in general, general Massey? Is 'reactivation' as described a recommended way? Mother's all-curing recipe, do you have that?
>
> Ingemar Hernefjord
> Ericsson Microwave Systems
>
> -----Original Message-----
> From: Massey, Roger [mailto:[log in to unmask]]
> Sent: den 21 september 2000 09:39
> To: [log in to unmask]
> Subject: Re: [TN] Silver Epoxy Bleed on imersion Ni Au PCBs
>
> Dave,
>
>         In a previous life as a supplier of a similar automotive sensor, we
> found that the vacuum bake recommended by Steven when combined with using
> the absolute minimum of epoxy did the trick, easy to say I know but it took
> us weeks to get the thing sorted.  Also found that plasma cleaning after
> bond helped a bit with fighting off resin bleed, dont know why it just did
>
>                 Good luck
>
> Roger Massey
> Via Systems - Tyneside
>
> -----Original Message-----
> From: Creswick [mailto:[log in to unmask]]
> Sent: Thursday, September 21, 2000 3:29 AM
> To: [log in to unmask]
> Subject: [TN] Silver Epoxy Bleed on imersion Ni Au PCBs
>
> Dave,
>
> In the hybrid (or MCM) industry we have found a vacuum bake to be helpful in
> this situation.
>
> Try 50 mT @ 150°C for 2-4 hours.
>
> Steven Creswick
> CTS RFIM
>
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