Mike,
We print paste and dispense adhesive as a rule. It adds quite a bit of
insurance to the underside of our boards. We have experimented with no
pasting, just wave-soldering. Our yields went down at ICT and open
capacitors went through the roof. We run no-clean for the record. Hope this
helps.
Jason Gregory
Manufacturing Supervisor
ACT Manufacturing
Corinth, MS. 38834
(662)287-3771 x470
[log in to unmask]
> -----Original Message-----
> From: Mike Sewell [SMTP:[log in to unmask]]
> Sent: Friday, September 22, 2000 3:39 PM
> To: [log in to unmask]
> Subject: [TN] Bottom Side wave soldering of SMT parts
>
> We build a mixed technology board here with bottom side SMT (SOTs, small
> chips, all laid out not to solder, ie..90 out from each other) and get
> very
> poor yield from wave (chip + lamda) solder. We print the adhesive on,
> P&P,
> cure, stuff, wave then TOUCH UP. My question is: what about printing
> paste,
> dispensing glue (or vice versa), P&P, reflow/cure, stuff, then wave? Will
> having an existing joint make life easier on wave skips, or will the wave
> disturb the skipped joints to the point of needing touch up?
>
> Haven't tried it yet because our dispenser is down,
> Mike Sewell
>
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