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September 2000

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Subject:
Re: Silver Epoxy Bleed on imersion Ni Au PCBs
From:
"Massey, Roger" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Sep 2000 08:39:05 +0100
Content-Type:
text/plain
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text/plain (58 lines) 
Dave,

        In a previous life as a supplier of a similar automotive sensor, we
found that the vacuum bake recommended by Steven when combined with using
the absolute minimum of epoxy did the trick, easy to say I know but it took
us weeks to get the thing sorted.  Also found that plasma cleaning after
bond helped a bit with fighting off resin bleed, dont know why it just did

                Good luck

Roger Massey
Via Systems - Tyneside
-----Original Message-----
From: Creswick [mailto:[log in to unmask]]
Sent: Thursday, September 21, 2000 3:29 AM
To: [log in to unmask]
Subject: [TN] Silver Epoxy Bleed on imersion Ni Au PCBs


Dave,

In the hybrid (or MCM) industry we have found a vacuum bake to be helpful in
this situation.

Try 50 mT @ 150°C for 2-4 hours.

Steven Creswick 
CTS RFIM

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