Hi,
You do not have to go any farther than IPC-D-279, Appendix A.
Werner Engelmaier

In a message dated 09/21/2000 12:20:13 PM Central Daylight Time,
[log in to unmask] writes:
> Hi Technetters,
>  Does anyone know where I can find out more information about comparing
>  the solder joint reliability using Solder Mask define footprint vs
>  Copper define footprint?  Or if you have any paper on this subject in
>  soft copy, please forward to me.
>  Alex Chan

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