Of course I agree with your and everyone else's comments and concerns, just thought I'd
toss out the question. What the article discussed was using the AOI to 'enhance' the
testing, I brought up instead of testing.
Now let me ask you (and all assemblers and board buyers) this, if I showed you data, or
had data available confirming the integrity of the vias and all through holes, had
performed AOI to ensure all layers were as the gerber intended including of course
being free of processing defects, opens, shorts, etc, would you waive test on the
boards? ~grinning as all the engineers cringe at the thought~
Franklin D Asbell
Ian Hanna wrote:
> As has been mentioned, AOI will not pick up interconnect defects. It would
> also not be a reliable way of testing inner-layer functions on a multi-layer
> product. I would submit that electrical test provides a much greater margin
> of overall acceptability and functionality. Using a 'bed-of-nails' type
> electrical test is also significantly faster than optical scanning, although
> this technique is not feasible for fine-pitch work.
>
> Regards,
>
> Ian Hanna
> Quality Manager
> Lazer-Tech Ltd.
> Voice: 416.291.7727.233
> FAX: 416.291.0325
> [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of
> [log in to unmask]
> Sent: Friday, September 01, 2000 2:21 PM
> To: [log in to unmask]; [log in to unmask]
> Subject: Re: [TN] Automatic Optical Test (AOT)
>
> Franklin,
>
> I have not read the article, but a user of boards. Here are my first,
> knee-jerk,
> questions. Perhaps the article answered them, and I should get a copy of
> the article.
>
> On a twelve layer multilayer board, how would AOT verify compliance to the
> IPC-D-356
> net list that I provide?
> Does the addition of Laser vias, buried and blind vias to the design change
> anything?
> Buried resistance?
>
> I think it sounds like an imaginative idea, perhaps reducing the Capitol
> $$$'s required
> for a board shop.
> Still, I am standing here, wondering what to do with this bucket of cold
> water.
>
> George Franck
> Raytheon Company
> Falls Church VA
>
> Franklin D Asbell wrote:
>
> > Just read an article in "The Board Authority" regarding Automatic
> > Optical Test (AOT).
> >
> > Just wondering what you assemblers or purchasers of bare boards thoughts
> > are on fabricators performing 'optical testing' (visual, AOI) instead
> > of 'contact testing' (BON, probe)????
> >
> > An example: You state all boards to be electrically tested for
> > opens/shorts, and instead of throwing the boards on our flying probe or
> > bed-of-nails equipment I decide to put this on my AOI after setting it
> > up to flag for opens/shorts, would you be satsified with this method?
> >
> > Franklin D Asbell
> > Network Circuits, Inc.
> > Irving, Texas 75061
> >
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