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September 2000

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Subject:
From:
"Ellsworth D. Berkowitz" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Sep 2000 16:31:10 -0500
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Here are some links referencing solder mask defined/non-solder mask defined
(SMD/NSMD) pad reliability.  Generally, these references report that NSMD
designs provide more reliable solder joints than the SMD approach.

www.intel.com/design/flash/packdata/csp/download.htm
www.mot-sps.com/cgi-bin/get.pl?/books/apnotes/pdf/an1231*.pdf
www.amkor.com/customer_center/assembly_and_test/white_papers/index.htm

FYI, our CCA designs that use BGA have NSMD pads.  We have used BGA
technology in our products (telecom, broadband, high speed network access)
for approximately four (4) years now.  Our products are typically installed
in controlled environment settings (commercial, residential, telco central
office, etc.) and do not experience the extremes of automotive or aerospace
applications.

Thanks to all TechNet contributors!  I've used this resource for some time
and find the discussions most relevant.  I'm glad that I have the
opportunity to contribute to this forum!

P.S. - I'm attending the SMTA International 2000 Conference in Chicago from
25-28 September.  I'm focusing primarily on CSP, alternative PWB finishes,
BGA rework, and the double-sided reflow process (manufacturing and test).
If anyone else is attending and would like to trade "war stories" at this
time, please contact me via email.

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