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September 2000

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Subject:
From:
Paul Fly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Sep 2000 15:47:33 -0400
Content-Type:
text/plain
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text/plain (85 lines)
From: Paul M Fly

Mark,

  The thick film processes I am familiar with from a previous job are for
hybrids, typically on
ceramic substrates. The conductors are put down in the form of gold or
silver filled inks which
are then fired. The firing process sinters the metal and leaves permanent
metal interconnections
on the substrate. Are you working with ceramics? or are you talking about
putting printed
resistors on printed circuit boards? or am I just out in left field?

*********************************
          Paul Fly

Eastman Kodak Company
Engineering Technology Center
901 Elmgrove Rd.
Rochester, New York 14653-5313
Phone: (716) 726-5670
Fax: (716) 726-0275
E-mail: [log in to unmask]
*********************************





Mark Hargreaves <[log in to unmask]> on 09/21/2000 03:18:45 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Mark Hargreaves <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Paul M Fly/243609/EKC)
Subject:  [TN] thick film prototypes




Hi All,
     Can anyone suggest a source for thick film boards in prototype
quantities.
Also, would someone kindly give me the short definition of thick film
boards.

Thanks,
Mark Hargreaves

P.S. This is my 1st post, although I've been watching from the shadows for
a
few weeks. Useful & interesting subjects; timely & friendly responses.

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