Hi Stella,
I dont know what your build style is, but I know that its common to
laminate flex, FR4 and Ive even seen ceramic onto a metallic back plate or
rigidiser. This not only stiffens up the flex, but its more commonly used to
give a good thermal path for power devices etc. Anyway, with BGA,s the
thermal cycling performance, and shock to some degree is drastically
effected by the presence of the rigidiser, if memory serves right, I was
getting mean time to failure to drop by approx 40% under this build type,
this was made some what worse by the use of an underfill. I dont know if
this is relevant or not, but you never know. As Werner says, uBGA are used
in automotive application, but I dont ever recall seeing one under hood.
No doubt somebody knows different, but thats my two peneth.
Roger Massey
Via Systems Tyneside
-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Thursday, September 21, 2000 4:23 PM
To: [log in to unmask]
Subject: Re: [TN] Micro BGA application
Hi Stella,
Reliability concerns are greater for automotive electronics than for any
other applications, except down-hole drilling. Yes, micro-BGAs can be used,
but you need to go to a technology like the Tessera micro-BGAs.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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