In a message dated 09/21/2000 12:20:13 PM Central Daylight Time,
[log in to unmask] writes:

> Hi Technetters,
>
>  Does anyone know where I can find out more information about comparing
>  the solder joint reliability using Solder Mask define footprint vs
>  Copper define footprint?  Or if you have any paper on this subject in
>  soft copy, please forward to me.
>
>  Thanks,
>  Alex Chan

Hi Alex!

Go to:

http://extra.ivf.se/ngl/E-BGA/ChapterE2.htm
http://www.maxim-ic.com/1st_pages/UCSP.htm
http://indy2.automata.com/newsroom_new/papers/evans/e2.htm
http://indy2.automata.com/newsroom_new/papers/evans/e1.htm

All these links have something in them about solder mask defined and non
solder mask defined pads...

-Steve Gregory-

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