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September 2000

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Subject:
From:
Bogdan Gabi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 Sep 2000 18:07:46 +0300
Content-Type:
text/plain
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text/plain (90 lines)
Thank you,Ryan!
what about adheasive cleaning and OSP?
Gaby

> ----------
> From:         Ryan Grant[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Ryan Grant
> Sent:         ?יום שלישי 19 ספטמבר 2000? 17:20
> To:   [log in to unmask]
> Subject:      Re: [TN] Missprints
> 
> Gabi,
>         I'm afraid that if you want to remove the flux in the solder
> paste,
> you must use a solvent that also removes the OSP coating.  So joint the
> rest
> of us in the frothing sea and use IPA.  Just make sure you reprint that
> board as soon as it is clean.  (Works great!).  By the way, if you use
> no-clean, you will need to use an ultrasonic cleaner to avoid solderballs.
> It is impossible to completely clean solder paste out of vias without it.
> 
> Thanks
> 
> Ryan Grant
> Advanced Technology Engineer
> MCMS
> (208) 898-1145
> [log in to unmask]
> 
> 
> > -----Original Message-----
> > From: Bogdan Gabi [SMTP:[log in to unmask]]
> > Sent: Tuesday, September 19, 2000 5:00 AM
> > To:   [log in to unmask]
> > Subject:      [TN] Missprints
> >
> > Dear TechNetters,
> > Which solvents and methods are the best for missprint cleaning on OSP
> > coated
> > boards?
> > Thank you,
> > Gaby
> >
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