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September 2000

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Subject:
Re: SMT heat sink attachment
From:
pratap <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 14 Sep 2000 15:09:41 -0700
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (269 bytes) , rampinc.vcf (149 bytes) 
Remi,
Call IBM and ask them to let you use US patent No 5654876 dated Aug. 5,
1997 and US patent 5754400 dated May 19, 1998. The two designs just
solve the problem you described.
No holes drilled in the board, can use heat transfer pad from 3m between
component and heat sink.

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