Phil:
Good points.
I agree with all your additional comments and clarifications
Regards, Paul
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Dutton
Sent: Wednesday, 13 September, 2000 19:47
To: [log in to unmask]
Subject: Re: [TN] PCB fabrication notes
Hello Paul,
Not IPC-A-600. Sometimes people call that up as if it is a procurement
spec, but it is not.
(the 'scope' and 'purpose' paragraphs of this document explains this
better, if you can get a look at a copy.)
A typical note that I use is as follows;
"Fabricate in accordance with IPC-6011/6012 class 2 using IPC-A-600 for
visual evaluations and interpretations."
(6012 is for rigid boards, 6013 for flex, etc..)
I still specify board profiling and hole position tolerances by geometric
dimensioning and tolerancing methods however.
Cu thickness, board finish (HASL, Ni/Au etc.), soldermask type, etc., I
call up in a table.
I hope this is of some help.
regards,
Phil.
At 14:28 13/09/00 -0400, you wrote:
>I am trying to update and standardize the notes that appear on our printed
>circuit board fabrication (drill drawing) drawing. The current drawing has
>over 20 notes detailing things like hole registration electroplating
>thickness, wrap and twist ECT. I would like to reference one specification
>that covers all aspects of the board fabrication and eliminate all the
>specific notes.
>
>Is there and industry standard on what needs to be specifically called out
>on the fabrication drawing and what is the best specification to reference
>(IPC-A-600?) for fabricating 4 layer commercial grade surface mount PCB's.
>
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Phil Dutton C.I.D.
Senior CAD Technician
IPC Certified Interconnect Designer
Tenix Defence Systems Pty Ltd
Systems Division - Adelaide
Second Avenue, Technology Park,
Mawson Lakes. SOUTH AUSTRALIA 5095
================================
Phone: (08) 8300 4400 (reception)
Fax: (08) 8349 7420
email: [log in to unmask]
Internet Page: http://www.tenix.com
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