Hi again,
Does anyone have specifications or direct me to sources with infor. on the
maximum cycles a Cmos chip (ASIC) in a plastic SOIC package are allowed to
be exposed to in a reflow oven or rework (hand solder) environment?
Reflow oven = 240C peak, 6 to 8 minutes in oven.
Solder iron temp. = 260C to 370C
TIA
Francis
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