hi,

you might try hysol (http://www.dexelec.com/dexelec/epp/electronic_products.html3m).  many, many, many years ago my job and life (pityful, no?) was wrapped around potting and encapsulating military and space electronic modules.  that process seems to have gone the way of vacuum tubes.  i was going to also suggest 3m (a big supplier back then), but they seem to be out of this business.

phil

-----Original Message-----
From: Hinners Hans Civ WRALC/LYPME [mailto:[log in to unmask]]
Sent: Wednesday, September 13, 2000 12:27 PM
To: [log in to unmask]
Subject: [TN] Potting Compounds


Hi All,

I have a rare treat! - I get to recommend a substitute potting compound for
a component we build.  We pot several discrete components - it's not more
than 2 cm long x 1 cm wide x 1.5 cm tall.

The drawing called for a Courtaulds Aerospace (now PRC DeSoto) compound
PR-1660, but that was replaced by PR-1664-D.  Even with several cycles in a
vacuum chamber we can't get the bubbles out of the mixed compound before it
sets up (15 - 20 minutes).  Part A pours like honey even before you start
mixing with Part B.  We plan to use an injection mold or a simpler pour
mold.  I plan to talk to PRC Desoto later today but I seek words of wisdom
from the Group.

So, does anyone know of a honey colored potting compound that doesn't
generate bubbles as it cures?  Oh yeah, something approved by an IPC or an
old Mil Spec would be an added bonus.

Thanks Gang!

Hans

~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Materials Engineer (Process & Manufacturing)
Warner Robins Air Logistics Center
Avionics Production Division
Precision Attack/ Radar/Manufacturing Branch
Engineering Section
380 Second Street, Suite 104
Building: 640, Mail Stop: LYPME
Robins AFB, GA 31098-1638
Voice: (478) 926 - 1970 Fax: (478) 926 - 7164
mailto:[log in to unmask]
http://www.robins.af.mil

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