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September 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 12 Sep 2000 17:01:08 EDT
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In a message dated 09/12/2000 3:03:14 PM Central Daylight Time,
[log in to unmask] writes:

> Hi Werner, Phil, Steve & Kate et al
>  Surely this is just a case of if you have enough zones in your oven to
> comfortably run a ramp-soak-spike then you use it. Otherwise,
>  if you have a short poxy three zone (top & bottom) oven like myself then
you
> go with the tent profile because you have no
>  choice.....
>
>  Justin Braime
>  ------------------------
>  Process Engineer
>  Compuspec Industries Ltd
>  1a Niall Burgess Rd
>  Mt Wellington
>  Auckland, New Zealand
>  Ph: +64 9 574 1990
>  Fax: +64 9 574 1988

Hi Justin!

That may be true, but I'm also finding that some solder paste vendors are
recommending tent, or ramp-to-spike profiles. Go to:

http://www.aimsolder.com/techarticles/techarticles.htm#reflow

Reflow Profiling: The Benefits of Implementing a Ramp-to-Spike Profile
ABSTRACT: The issue of reflow profiling continues to be a complex subject.
The pains often associated with profiling can be reduced greatly if certain
guidelines are followed and if there is a strong understanding of the
variables that can be encountered during the reflow process. This paper shall
discuss the appropriate guidelines and troubleshooting methods for reflow
profiling, and in particular shall focus upon the benefits of implementing
the linear ramp-to-spike profile, which include a simplification of the
process, reduced energy costs, fewer solder defects, and improved wetting.
Included in this paper are the suggested process parameters for setting up
the ramp-soak-spike and ramp-to-spike profiles and the chemical and
metallurgical reactions that occur at each set point of these profiles. The
paper concludes with a discussion and pictures of several profile-related
defects. Each of these defects is described, analyzed, and instructions are
given for troubleshooting these defects.

If you go to: http://www.microbond.demon.co.uk/ws300_305.htm you'll see that
Microbond also recommends a ramp-to-spike profile for their water soluble
paste...

Now I'm really confused...

-Steve Gregory-

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