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September 2000

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Subject:
From:
Phil Zarrow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 11 Sep 2000 21:56:02 EDT
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Hi Kate (and all)-
I've written a number of articles about the ramp or tent profile and am
clearly and advocate of it.  It was made possible with the superior thermal
transfer capability and performance of modern convection dominant (forced
convection) reflow ovens.
In the past year, I did a project for one of the major data tracker
manufacturers where I characterized the parameters and specifications of the
major solder pastes on the market (it was for a self-profiling methodology
they the data tracker company was developing).  I queried all the major
solder paste manufacturers including AIM, Alpha, EFD, OMG, Kester, Indium,
Multicore, Senju, Qualitek, among others and included most alloys offered and
no-clean, RMA and OA flux formulations.  Over 90% of the formulations have no
problem at all with a ramp profile - i.e. no-soak.  It was put there many
years ago to accomodate the less efficient convection-IR oven methodology and
people came to believe the soak was required.
I am co-chairing (with Les Hymes) an IPC task group to re-define reflow
parameters.  A number of people Technetters would recognize (including Werner
E) are members of this group.  (Of course, being a comittee, my fear is that
by the time we hammer out a spec, reflow will be obsolete).  But in the
meantime, I urge everyone who has notg yet tried it, to do some experimenting
with the ramp profile.  It is not for every application, but it will work and
even improve most.
Regards,
Phil Zarrow
ITM, Inc.
Durham, NH  USA
www.ITM-SMT.com

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