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September 2000

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Subject:
From:
Mike Sewell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 11 Sep 2000 12:20:35 EDT
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We have build a set of boards here that have PQFP 304 (up to 4 per bd) with
heat sinks on them and have had loads fun placing them.  As mentioned
elsewhere, we tried tackier pastes, moving them to the end of the pick and
place program, adjusting the placement height in paste, and finally wound up
tacking the corners (with a soldering iron) prior to reflow after hand
placement of a few switches & LEDs.  Not a good solution but ....  One
question: Have you verified your placement prior to any movement of the
board?  Sometimes heavier parts will shift on the nozzle after vision but
before/during placement.

Mike Sewell

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