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September 2000

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Subject:
From:
Julien Bouchard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 11 Sep 2000 11:03:46 -0400
Content-Type:
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Hi everybody,
        We currently have problems with some PQFP ( 208 and 240 pins ) that have a
piece of metal mold inside the IC to enhance the thermal exchange. Because
of this metal, the IC is very heavy, in comparaison of other IC. After they
have been place by the pick and place machine, they often move from there
original position when the conveyor start or stop. It seem that the IC is so
heavy, and is inertia is taller than the retention force of the paste. We
try a lot of solution, but none of them give a good and constant result.
        We want to know if someone have similar problem and if a good solutions
have been found. Thank you.

Julien Bouchard
Matrox - Process Engineer
Email : [log in to unmask]

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