TechNetters, 

We have here some assemblies that were in a building (a customer's, not ours) that leaked during a rain storm.  Various portions of them have a dirty deposit that is curiously tenacious, by which I mean it is easily scraped off, but cannot be removed by blowing or light wiping.   

We are considering running the assemblies through our conveyorized cleaning process, but are not sure which components can tolerate it.  The wash solution is a 130 F, 9% solution of monoethanolamine (we use an RMA flux).  130 F water rinse follows.

May I get some advice about what to do with these components?  Can they go through our cleaning process?


DIPs in sockets
Pin Grid Arrays in sockets
Quad pack ICs in tin contact sockets
'D' connectors, male (I think that's what they're called, they have a metal shell sticking out around the pins)
DIN connectors, male and female (rectangular, grey plastic housing)
LEDs in plastic housings
"Cannon" connectors, male (if that is the correct terminology, they have heavy pins sticking in an array out of a plastic block)

Thanks for any comments.

Lou Hart
Compunetix 
Quality Assurance
412-858-6184

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