Mick,

You've already received good input on your other questions so I'll just add
to the wire bond question. A combination of mechanical and vacuum hold down
should solve the movement problem. I don't know the shape or size of your
board but add mechanical hold down using a split clamp system if possible.
There are a number of approaches depending on the board or panel size,
shape, thickness and # of chips to be bonded. I too have used aluminum
fixtures with much success but steel (tool, preferably Ni plated or
stainless) could offer advantages. You can contact me off line if you need
more specfic information.

Good Luck,
Bruce Misner

> ----------
> From:         Mick Thwaite[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Mick Thwaite
> Sent:         Friday, September 08, 2000 4:02 AM
> To:   [log in to unmask]
> Subject:      [TN] Flex PCB's
>
> We are just starting to use flex PCB's in our production area.
>
> Is it true that the PCBs have to be dried prior to using as they absorb
> moisture quickly?
>
> Is it also true that hot air is better than IR reflow?, and
>
> Does anybody have any good ideas on the materials to use for the vacuum
> jig to hold down the panel during wire bonding?
> We have used vacuum holds as small as 1.00 mm but still find that the PCB
> moves during bonding.....
>
>
>
> Mick Thwaite
>

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