We are a PWB fab house.

We' ve recently come across a requirement to fab boards with vias located in
SMT pads. The requirement is to have these vias completely shut and as close
as possible to flush with the pad surface. Initial thought was given to
copper plating completely shut but have CTE concerns. Thought is also being
given to epoxy fills and then metallization.

Does anyone have any thoughts on the best way to achieve this condition? Are
there any reliability pitfalls?

Thanks in Advance,

Bob Dube
ES&D

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