I would like to have the opinion of you knowledgeable people how have
  experience with this type of  boards.
 We are designing our first Blind and Buried vias board these days.
 I wonder how I should specify on the Master Drawing the tolerances of these
 features .
 Specifically: Blind vias with FHS of 0.1 mm  and minimum avg. Cu plating
 of 13 micron, what tolerance is usually spec'd for the hole .- I guess
 some tolerance have to be specified.
 Same questions for the Buried Via .
 Is it common to note on the drawings that (standard)  Via holes don't need
 to be measured and may be partially closed with solder?
 and how would I go with OSP or gold finish for the same case.

 TIA
 Mickey


Michael Weiner
Tel  (972-3) 9262937
Fax  (972-3) 9261803
mailto:[log in to unmask]

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