TECHNET Archives

September 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 29 Sep 2000 10:32:37 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines)
Kuan

As Werner already mentioned, the metallurgy of your solder joint will change significant during the annealing. However, it depends on the conditions of use whether this changes ( Thicker intermetallics, enhanced Pb concentration at the interfaces, growth of Pb phases, secondary segregation in the bulk etc. ) are of significance for the reliability of your assembly. As much as I remember, Werner, didn't you do some work on tested joints with and without annealing in order to show that annealing ahead of thermal cycling tests is important?

Best regards

Guenter

Guenter Grossmann
Swiss Federal Institute for Materials Testing and Research EMPA
Centre for Reliability
8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :      xx41 1823 4054
mail:     [log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2