We regularly mount 0603 parts on the back side of production boards, both
reflow and wave soldering.  The pad geometry for wave soldering is extended
10 mils further out on either side of the part than for reflow, and is also
slightly (1 mil) wider than the part.  I believe 2 glue dots are used for
wave soldering, one on either side of the part between the pads.

For many lower production boards we reflow the SMD parts then put the board
in a fixture to wave solder any thru-hole parts.

--
George Patrick
Tektronix, Inc.
Central Engineering,  M/S 39-512
P.O. Box 500
Beaverton, OR 97077-0001
Phone: 503-627-5272    Fax: 503-627-5587



-----Original Message-----
From: Rich Schutz [mailto:[log in to unmask]]
Sent: Wednesday, September 27, 2000 07:20
To: [log in to unmask]
Subject: [DC] Wave solder 0603 components


 We have concerns of solder bridging occurring when wave soldering 0603's.
Can
anyone tell me if they ever done this before?

1). What were the results ?
2). What pad geometries did you use?