Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 19 Sep 2000 18:07:46 +0300 |
Content-Type: | text/plain |
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Thank you,Ryan!
what about adheasive cleaning and OSP?
Gaby
> ----------
> From: Ryan Grant[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;Ryan Grant
> Sent: ?יום שלישי 19 ספטמבר 2000? 17:20
> To: [log in to unmask]
> Subject: Re: [TN] Missprints
>
> Gabi,
> I'm afraid that if you want to remove the flux in the solder
> paste,
> you must use a solvent that also removes the OSP coating. So joint the
> rest
> of us in the frothing sea and use IPA. Just make sure you reprint that
> board as soon as it is clean. (Works great!). By the way, if you use
> no-clean, you will need to use an ultrasonic cleaner to avoid solderballs.
> It is impossible to completely clean solder paste out of vias without it.
>
> Thanks
>
> Ryan Grant
> Advanced Technology Engineer
> MCMS
> (208) 898-1145
> [log in to unmask]
>
>
> > -----Original Message-----
> > From: Bogdan Gabi [SMTP:[log in to unmask]]
> > Sent: Tuesday, September 19, 2000 5:00 AM
> > To: [log in to unmask]
> > Subject: [TN] Missprints
> >
> > Dear TechNetters,
> > Which solvents and methods are the best for missprint cleaning on OSP
> > coated
> > boards?
> > Thank you,
> > Gaby
> >
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