TECHNET Archives

September 2000

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Date:
Tue, 26 Sep 2000 21:47:01 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Dave Gardiner <[log in to unmask]>
Subject:
ENIG SMD PWBs Aluminum wire bonding
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset=us-ascii
Organization:
React Electronics, Circuit~tech
From:
Dave Gardiner <[log in to unmask]>
Parts/Attachments:
text/plain (23 lines) 
Thanks all for your suggestions on epoxy bleed. Plasma clean and vacuum
bake are being investigated. Has anyone seen any specifications that
cover epoxy bleed or bondability. We have one part number where we have
twice had trouble with no stick to 15 grams pull on the same panels. We
had tests done for surface contamination but there was little difference
in the findings between good and bad boards.

Dave Gardiner

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2