TECHNET Archives

August 2000

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Silver Palladium plating
From:
Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 1 Aug 2000 21:48:27 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Ken,

Unless the underlying termination has a nickel barrier layer to prevent
leaching of the component termination, I would be extremely cautious about
doing as you suggest.

Steven Creswick
CTS RF Integrated Modules

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2