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August 2000

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Subject:
From:
Mike Sewell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 8 Aug 2000 12:04:21 EDT
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Have you tried removing the coplanarity with a lead forming press? (several
places offer rework/lead forming as a service and/or can provide a custom die
set)  Sounds like you might also need some sort of matrix tray to protect the
leads... This would allow a solder stencil print -> pick & place -> reflow
process to be implemented.  With the hot bar soldering you might be
pre-stressing the joints with coplanarity, but I don't know if its a
significant issue.

Regards,
Mike Sewell

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