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August 2000

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 8 Aug 2000 10:02:30 +1000
Content-Type:
text/plain
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Hi Alejandro ,
you've just made me to open July's SMT issue bag:
Stencil Design for mixed tech placement & reflow.

It's yesterday's news, still, you may be interested.

it may even be on http://www.smtmag.com

paul

-----Original Message-----
From: Becerra Alejandro [mailto:[log in to unmask]]
Sent: Tuesday, 8 August 2000 9:28
To: [log in to unmask]
Subject: [TN] Issues in Soder Paste Printing


Hello TechNetters,

We are trying to better control our solder paste printing process.
Where can I find information about solder paste process?
I am looking for information about practices in the machine e.g.:
*       Solder Paste handling
*       Stencil cleaning
*       Board cleaning
*       Machine parameters (Temperature, printing speed)
*       Amount of solder paste in stencil
*       Inspection of solder paste deposits (SPC charts of height, size)

Thanks

Alejandro Becerra
Phone (915) 841-8518, Fax (915) 841-8518
[log in to unmask]

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