TECHNET Archives

August 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 7 Aug 2000 17:52:11 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (123 lines)
Many thanks Jack.  Looking forward to the official release version.  Thanks
again.
                            joyce
At 03:23 PM 8/7/00 -0500, you wrote:
>Joyce, IPC-7095 Design and Assembly Process Implementation for BGAs passed
ballot and is being prepared for printing.  You should expect to see it at
IPCWorks the 2nd week of September in Miami
(http://www.ipc.org/html/ipcworkshome.htm).  If you're subscribed to
IPC_New_Releases listserv you'll get a msg when it's in stock and available
for purchase.
>
>Jack
>
>>>> joyce <[log in to unmask]> 08/05/00 04:27PM >>>
>Does anyone know that the IPC-7095 is being published or not?  The following
>infor is almost 1 year old:
>"New IPC-7095 covers this topic (Design and Assembly process
>implementation
>for BGA's). You can down load it from their web site. It is in final
>draft
>at present time."
>                                  jk
>>Date: Fri, 04 Aug 2000 21:54:19 -0400
>>To: "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
>>From: joyce <[log in to unmask]>
>>Subject: Re: [TN] BGA Pad Size
>>
>>1999 IPC has a draft of BGA design and manufacturing doc. in the
>works...Does anyone know the status of the document?
>>                                    jk
>>At 08:48 PM 8/4/00 EDT, you wrote:
>>>In a message dated 8/4/00 5:59:16 PM EST, [log in to unmask] writes:
>>>
>>><< TechNet Designers,
>>>
>>> I was looking in IPC-SM-782 and IPC-D-279 and didn't find anything specific
>>> on BGA pad guidelines.
>>> I see in the IPC Technical Info book that there is an amendment 2 that
>>> addresses BGA pad design.
>>>
>>> While I am getting that amendment ordered, is there any standard "rule of
>>> thumb" for pad size
>>> relative to ball diameter on 1.27m and 1.0m BGA's that should be followed,
>>> or that you have found to be
>>> useful in designing boards with BGA devices?
>>>
>>> Thanks for your help and opinions.
>>>
>>> Regards....DT >>
>>>
>>>Hi Darrel,
>>>
>>>Just as Jeff said, Motorola's AN1231 app notes is pretty good, but he didn't
>>>say where you could get it. Go to:
>>>
>>>http://mot-sps.com/cgi-bin/get?/books/apnotes/pdf/an1231*.pdf
>>>
>>>Just tryin' ta' help...
>>>
>>>-Steve Gregory-
>>>
>>>##############################################################
>>>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>>>##############################################################
>>>To subscribe/unsubscribe, send a message to [log in to unmask] with
>following text in
>>>the body:
>>>To subscribe:   SUBSCRIBE TECHNET <your full name>
>>>To unsubscribe:   SIGNOFF TECHNET
>>>##############################################################
>>>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>>>information.
>>>If you need assistance - contact Keach Sasamori at [log in to unmask] or
>>>847-509-9700 ext.5315
>>>##############################################################
>>>
>>
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
>the body:
>To subscribe:   SUBSCRIBE TECHNET <your full name>
>To unsubscribe:   SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information.
>If you need assistance - contact Keach Sasamori at [log in to unmask] or
>847-509-9700 ext.5315
>##############################################################
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
>the body:
>To subscribe:   SUBSCRIBE TECHNET <your full name>
>To unsubscribe:   SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information.
>If you need assistance - contact Keach Sasamori at [log in to unmask] or
>847-509-9700 ext.5315
>##############################################################
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2