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August 2000

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Date:
Sat, 5 Aug 2000 17:27:37 -0400
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Does anyone know that the IPC-7095 is being published or not?  The following
infor is almost 1 year old:
"New IPC-7095 covers this topic (Design and Assembly process
implementation
for BGA's). You can down load it from their web site. It is in final
draft
at present time."
                                  jk
>Date: Fri, 04 Aug 2000 21:54:19 -0400
>To: "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
>From: joyce <[log in to unmask]>
>Subject: Re: [TN] BGA Pad Size
>
>1999 IPC has a draft of BGA design and manufacturing doc. in the
works...Does anyone know the status of the document?
>                                    jk
>At 08:48 PM 8/4/00 EDT, you wrote:
>>In a message dated 8/4/00 5:59:16 PM EST, [log in to unmask] writes:
>>
>><< TechNet Designers,
>>
>> I was looking in IPC-SM-782 and IPC-D-279 and didn't find anything specific
>> on BGA pad guidelines.
>> I see in the IPC Technical Info book that there is an amendment 2 that
>> addresses BGA pad design.
>>
>> While I am getting that amendment ordered, is there any standard "rule of
>> thumb" for pad size
>> relative to ball diameter on 1.27m and 1.0m BGA's that should be followed,
>> or that you have found to be
>> useful in designing boards with BGA devices?
>>
>> Thanks for your help and opinions.
>>
>> Regards....DT >>
>>
>>Hi Darrel,
>>
>>Just as Jeff said, Motorola's AN1231 app notes is pretty good, but he didn't
>>say where you could get it. Go to:
>>
>>http://mot-sps.com/cgi-bin/get?/books/apnotes/pdf/an1231*.pdf
>>
>>Just tryin' ta' help...
>>
>>-Steve Gregory-
>>
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