1999 IPC has a draft of BGA design and manufacturing doc. in the
works...Does anyone know the status of the document?
                                    jk
At 08:48 PM 8/4/00 EDT, you wrote:
>In a message dated 8/4/00 5:59:16 PM EST, [log in to unmask] writes:
>
><< TechNet Designers,
>
> I was looking in IPC-SM-782 and IPC-D-279 and didn't find anything specific
> on BGA pad guidelines.
> I see in the IPC Technical Info book that there is an amendment 2 that
> addresses BGA pad design.
>
> While I am getting that amendment ordered, is there any standard "rule of
> thumb" for pad size
> relative to ball diameter on 1.27m and 1.0m BGA's that should be followed,
> or that you have found to be
> useful in designing boards with BGA devices?
>
> Thanks for your help and opinions.
>
> Regards....DT >>
>
>Hi Darrel,
>
>Just as Jeff said, Motorola's AN1231 app notes is pretty good, but he didn't
>say where you could get it. Go to:
>
>http://mot-sps.com/cgi-bin/get?/books/apnotes/pdf/an1231*.pdf
>
>Just tryin' ta' help...
>
>-Steve Gregory-
>
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