In a message dated 8/4/00 5:59:16 PM EST, [log in to unmask] writes:

<< TechNet Designers,

 I was looking in IPC-SM-782 and IPC-D-279 and didn't find anything specific
 on BGA pad guidelines.
 I see in the IPC Technical Info book that there is an amendment 2 that
 addresses BGA pad design.

 While I am getting that amendment ordered, is there any standard "rule of
 thumb" for pad size
 relative to ball diameter on 1.27m and 1.0m BGA's that should be followed,
 or that you have found to be
 useful in designing boards with BGA devices?

 Thanks for your help and opinions.

 Regards....DT >>

Hi Darrel,

Just as Jeff said, Motorola's AN1231 app notes is pretty good, but he didn't
say where you could get it. Go to:

http://mot-sps.com/cgi-bin/get?/books/apnotes/pdf/an1231*.pdf

Just tryin' ta' help...

-Steve Gregory-

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